PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD14L SOIC .150in0508Matte Tin150C / 1hr w/l 24 hours400 microinchesYes0.1432
MCP619T-I/SL |
RFQ for MCP619T-I/SL |
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| Technical/Catalog Information | MCP619T-I/SL |
| Vendor | Microchip Technology (VA) |
| Category | Integrated Circuits (ICs) |
| Packaging | Digi-Reel? |
| Amplifier Type | General Purpose |
| Number of Circuits | 4 - Quad |
| Package / Case | 14-SOIC (3.9mm Width) |
| Slew Rate | 0.08 V/s |
| Gain Bandwidth Product | 190kHz |
| Current - Supply | 19A |
| Current - Output/Channel | 17mA |
| Voltage - Supply, Single/Dual (±) | 2.3 V ~ 5.5 V |
| Output Type | Rail-to-Rail |
| -3db Bandwidth | - |
| Current - Input Bias | 0.015A |
| Operating Temperature | -40°C ~ 85°C |
| Voltage - Input Offset | 150V |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | MCP619T I SL MCP619TISL MCP619T I SLDKR ND MCP619TISLDKRND MCP619T-I/SLDKR |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP619T-I/SL | - | - | - |